CTLSH10-45M364

10A,45V Surface mount Rectifier-Schottky (>=1A) Single

Case Type: TLM364

Average Forward Current (IO)
10 A
Continuous Reverse Voltage (VR)
45 V
Forward Voltage (VF)
440 mV
Forward Voltage (VF)
340 mV
Forward Voltage (VF)
550 mV

(490 mV Typical)

Forward Voltage (VF)
420 mV
Junction Capacitance (CJ)
620 pF
Junction Temperature (Tj)
-55 — 150 °C
Peak Forward Surge Current (IFSM)
300 A
Peak Repetitive Reverse Voltage (VRRM)
45 V
Reverse Breakdown Voltage (BVR)
45 V
Reverse Voltage Leakage Current (IR)
50 µA

(20 µA Typical)

Reverse Voltage Leakage Current (IR)
9 mA
RMS Reverse Voltage (VR(RMS))
32 V
Storage Temperature (Tstg)
-55 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
60 °C/W
Thermal Resistance Junction-Lead (ΘJL)
7 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CTLSH10-45M364 BK Box@5,000 Active 10A,45V Surface mount Rectifier-Schottky (>=1A) Single EAR99 8541.10.0080 PBFREE
CTLSH10-45M364 TR13 Tape & Reel@5,000 Active 10A,45V Surface mount Rectifier-Schottky (>=1A) Single EAR99 8541.10.0080 TIN

Resources

Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:High Temp Solder Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CTLSH10-45M364.PDF Device Datasheet
Material Composition:TLM364 Material Composition
Package Detail Document:TLM364 Package Detail Document
Spice Model:Spice Model CTLSH10-45M364 Spice Model

We provide the highest level of support to insure product is delivered on-time:

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

We provide the highest level of support to insure product is delivered on-time:

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • Custom electrical curves
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development