CMHD2003
200mA,250V Surface mount Diode-Switching Single: High Voltage
Case Type: SOD-123
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IF = 100 mA
Test Conditions
f = 1 MHz
Test Conditions
IF = 30 mA
IR = 30 mA
IREC = 3 mA
RL = 100 Ω
Test Conditions
VR = 200 V
Test Conditions
VR = 200 V
TC = 100 °C
Ordering
Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
---|---|---|---|---|---|---|---|
CMHD2003 BK | Box@3,500 | Active | 200mA,250V Surface mount Diode-Switching Single: High Voltage | EAR99 | 8541.10.0070 | TIN |
Resources
Item | Type |
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No matching documents found. | |
Analytical Test Report:Copper Bond Wire | Analytical Test Report |
Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
Analytical Test Report:Leadframe | Analytical Test Report |
Analytical Test Report:Sn Plating | Analytical Test Report |
CMHD2003.PDF | Device Datasheet |
Material Composition:SOD-123 | Material Composition |
Package Detail Document:SOD-123 | Package Detail Document |
Process Change Notice:Copper Wire Bonding | Process Change Notice |
Product Reliability Data:SOD-123 Package Reliability | Product Reliability Data |
Spice Model:Spice Model CMHD2003 | Spice Model |
Product Support
Contact Product SupportWe provide the highest level of support to insure product is delivered on-time:
- Supply management (Customer portals)
- Inventory bonding
- Consolidated shipping options
- Custom bar coding for shipments
- Custom product packing
Design Support
Contact Design SupportWe provide the highest level of support to insure product is delivered on-time:
- Free quick ship samples (2nd day air)
- Online technical data and parametric search
- SPICE models
- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- Custom electrical curves
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development