CMHD2003

200mA,250V Surface mount Diode-Switching Single: High Voltage

Case Type: SOD-123

Average Forward Current (IO)
200 mA
Continuous Forward Current (IF)
250 mA
Forward Voltage (VF)
1 V
Junction Capacitance (CJ)
1.5 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current (IFSM)
1 A
Peak Repetitive Forward Current (IFRM)
625 mA
Peak Repetitive Reverse Voltage (VRRM)
250 V
Power Dissipation (PD)
400 mW
Reverse Recovery Time (trr)
50 ns
Reverse Voltage Leakage Current (IR)
100 nA
Reverse Voltage Leakage Current (IR)
15 µA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
312.5 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMHD2003 BK Box@3,500 Active 200mA,250V Surface mount Diode-Switching Single: High Voltage EAR99 8541.10.0070 TIN

Resources

Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CMHD2003.PDF Device Datasheet
Material Composition:SOD-123 Material Composition
Package Detail Document:SOD-123 Package Detail Document
Process Change Notice:Copper Wire Bonding Process Change Notice
Product Reliability Data:SOD-123 Package Reliability Product Reliability Data
Spice Model:Spice Model CMHD2003 Spice Model

We provide the highest level of support to insure product is delivered on-time:

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

We provide the highest level of support to insure product is delivered on-time:

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • Custom electrical curves
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development