CDM2208-800FP
8A,800V Through-Hole MOSFET N-Channel Enhancement Mode High Current
Case Type: TO-220FP
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IS = 8 A
di/dt = 100 A/µs
Test Conditions
IS = 8 A
di/dt = 100 A/µs
Test Conditions
VDS = 25 V
f = 1 MHz
Test Conditions
VDS = 25 V
f = 1 MHz
Test Conditions
VDS = 25 V
f = 1 MHz
Test Conditions
IS = 8 A
(0.9 V Typical)
Test Conditions
ID = 250 µA
Test Conditions
ID(on) = 8 A
VDD = 400 V
RG = 25 Ω
Test Conditions
VGS = 30 V
(30 nA Typical)
Test Conditions
VGS = 30 V
(30 nA Typical)
Test Conditions
ID = 250 µA
(2.9 V Typical)
Test Conditions
VDS = 640 V
VGS = 10 V
ID = 8 A
Test Conditions
VDS = 640 V
VGS = 10 V
ID = 8 A
Test Conditions
ID(on) = 8 A
VDD = 400 V
RG = 25 Ω
Test Conditions
VDS = 800 V
(0.05 µA Typical)
Test Conditions
VGS = 10 V
ID = 4 A
(1.42 Ω Typical)
Test Conditions
VDS = 640 V
VGS = 10 V
ID = 8 A
Test Conditions
VDD = 400 V
ID(on) = 8 A
RG = 25 Ω
Ordering
Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
---|---|---|---|---|---|---|---|
CDM2208-800FP | Sleeve@50 | Discontinued | 8A,800V Through-Hole MOSFET N-Channel Enhancement Mode High Current | EAR99 | 8541.29.0095 | PBFREE | |
CDM2208-800FP SL | Sleeve@50 | Discontinued | 8A,800V Through-Hole MOSFET N-Channel Enhancement Mode High Current | EAR99 | 8541.29.0095 | PBFREE |
Resources
Item | Type |
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No matching documents found. | |
Analytical Test Report:Die Attach | Analytical Test Report |
Analytical Test Report:Die Attach | Analytical Test Report |
Analytical Test Report:Epoxy Molding Compound | Analytical Test Report |
Analytical Test Report:Lead frame | Analytical Test Report |
Analytical Test Report:Lead frame | Analytical Test Report |
Analytical Test Report:Ni added Al Bond Wire | Analytical Test Report |
Analytical Test Report:Plating | Analytical Test Report |
Analytical Test Report:Pure Tin Plating | Analytical Test Report |
Analytical Test Report:Sn Plating | Analytical Test Report |
CDM2208-800FP.PDF | Device Datasheet |
Package Detail Document:TO-220FP | Package Detail Document |
Product EOL Notice:CDM22012-800LRFP | Product EOL Notice |
Spice Model:Spice Model CDM2208-800FP | Spice Model |
Product Support
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Design Support
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- SPICE models
- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- Custom electrical curves
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development