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CMLDM8005

650mA,20V Surface mount MOSFET Dual P-Channel Enhancement Mode

Case Type: SOT-563

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Technical Specifications

Similar Products with Selected Specifications
Common Source Input Capacitance (Ciss)
100 pF
Common Source Output Capacitance (Coss)
21 pF
Common Source Reverse Transfer Capacitance (Crss)
25 pF
Continuous Drain Current (ID)
650 mA
Continuous Source Current (Body Diode) (IS)
250 mA
Diode Forward On Voltage (VSD)
1.1 V
Drain-Source Breakdown Voltage (BVDSS)
20 V
Drain-Source Voltage (VDS)
20 V
Forward Transconductance (gFS)
200 mS
Gate Leakage Current, Forward (IGSSF)
10 µA
Gate Leakage Current, Reverse (IGSSR)
10 µA
Gate Threshold Voltage (VGS(th))
0.5 — 1 V
Gate-Drain Charge (Qgd)
0.36 nC
Gate-Source Charge (Qgs)
0.24 nC
Gate-Source Voltage (VGS)
8 V
Junction Temperature (Tj)
-65 — 150 °C
Maximum Pulsed Drain Current (IDM)
1 A
Power Dissipation (PD)
350 mW
Power Dissipation (PD)
300 mW
Power Dissipation (PD)
150 mW
Saturation Drain Current (IDSS)
100 nA
Static Drain-Source On Resistance (rDS(ON))
360 mΩ

(250 mΩ Typical)

Static Drain-Source On Resistance (rDS(ON))
500 mΩ

(370 mΩ Typical)

Static Drain-Source On Resistance (rDS(ON))
800 mΩ
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
357 °C/W
Total Gate Charge (Qg)
1.2 nC
Turn Off Time (toff)
48 ns
Turn On Time (ton)
38 ns

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMLDM8005 BK Box@5,000 Active 650mA,20V Surface mount MOSFET Dual P-Channel Enhancement Mode EAR99 8541.21.0095 PBFREE
CMLDM8005 TR Tape & Reel@3,000 Active 650mA,20V Surface mount MOSFET Dual P-Channel Enhancement Mode EAR99 8541.21.0095 TIN

Resources

Item Type
Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Halogen Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CMLDM8005.PDF Device Datasheet
Material Composition:SOT-563 Material Composition
Package Detail Document:SOT-563 Package Detail Document
Process Change Notice:Copper Wire Bonding - SOT-563 Process Change Notice
Process Change Notice:SOT-563 Alternate Lead Frame Process Change Notice
Product Reliability Data:SOT-563 Package Reliability Product Reliability Data
Spice Model:Spice Model CMLDM8005 Spice Model

Product Support

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Design Support

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  • Free quick ship samples (2nd day air)
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  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
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  • Special wafer diffusions
  • Custom electrical curves
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development