APEC 2026

Thank you to everyone who paid us a visit at APEC 2026! We appreciate the time spent discussing your latest design challenges and exploring solutions together.

If we missed you at APEC, you can still book an appointment with an expert! We'll help you solve your toughest design challenges with our newest solutions in power electronics:

• CMF High-Power Fuses:  Single SMD fuses for high-current circuits (60–200A, 75–125VDC), reducing PCB space, component count, and validation time.
• Die Solutions: Reliable discrete die in multiple formats, up-screened to MIL-PRF-38534 Class H/K, meeting strict performance and geometry requirements.
• Wide Bandgap Solutions: Minimize switching and conduction losses while supporting higher power density.