Die Solutions
Thinking beyond the package
When working with high-performance electronics, standard packaging can be the very thing holding back the practicality or feasibility of your design. Die Solutions from Central Semiconductor serve as a beacon of stability in the hybrid market, ensuring that designers have a consistent source for the discrete components they need.
By utilizing the semiconductor chip in its die form, designers are given unrivaled control over device configuration, thermal management, and electrical integrity.
Processes and facilities
- 100% of die is probed; rejects inked.
- All die are inspected in accordance to MIL-STD-750 Method 2073.
- Probing is performed in Central Semi's Class 1000 clean room.
- The majority of Central Semi's die inventory is held in the US at our facility based in Hauppauge, New York.
Packing options
- Fully probed wafers (rejects inked)
- Waffle tray packs (100% accepted die)
- Full wafer sawn on plastic ring (rejects inked)
Advantages of our bare die solutions
- Sourcing: We're a US-based supplier with 50+ years serving customers sensitive to COO and maintaining the highest quality standards.
- We maintain strategic oversight of our silicon pipeline, with 85% of wafers originating from “friendly” foundry partners in Japan and Taiwan.
- 100% of our extensive die bank inventory is secured at our New York facility.
- Traceability: We provide 100% traceability down to the individual wafer level. To support your manufacturing goals, we offer tailored Vendor Managed Inventory (VMI) and consignment options.
- In-house up-screening: All specialized testing and up-screening is performed on-site at our New York facility, keeping the entire process under one roof to reduce lead time.
- Advanced QA/FA analysis: Our commitment to zero defects is backed by 100% of wafer-level QA and FA performed by experts at our New York facility.
- Expansive portfolio: We offer one of the industry's broadest selections of discrete devices in wafer and die form.
- Versatility: To integrate seamlessly into your assembly process, our die solutions are available in multiple packaging options, including waffle pack (chip tray), wafer on membrane, or tape and reel.
Up-screened die solutions
We bridge the gap between commercial availability and mission-critical reliability to ensure every die meets the stringent demands of space and defense.