AEM's Tin Whisker Mitigation Process Earns Editor's Choice Recognition

Military Embedded Systems Magazine editors have singled out AEM's Sn / Pb conversion process for recognition in its July/August 2011 Issue.

SAN DIEGO, Calif., Aug. 30, 2011 — AEM, Inc. is pleased to announce the editors of Military Embedded Systems have selected the company's Sn/Pb (tin/lead) conversion process as their Editor's Choice. The announcement was made in the July/August issue. AEM's hi-rel-qualified Sn/Pb (tin/lead) conversion process is designed to mitigate the formation of tin whiskers in surface-mount components.

Here's what the editors had to say: "Whether we're talking the International Space Station, a C-17, or a Humvee, tin whiskers can throw a monkey wrench into system functionality—and even result in loss of life. However, AEM, Inc.'s tin/lead conversion process aims to stop tin whiskers in high-rel, surface-mount components originally terminated with tin-only solder. Moreover, AEM's tin/lead conversion process leaves even the most delicate electronics intact—as opposed to using all that hot soldering, which can damage sensitive components. Meanwhile, the tin/lead conversion process offers the assurance of at least 5 percent Pb in converted component terminations, as verified via XRF and SEM/EDS inspections." (Military Embedded Systems magazine Copyright OpenSystems Media, 2011. All rights reserved; used with permission.)

"We are very pleased to learn of this recognition by these respected journalists," said AEM's Marketing Director, Scott Sentz. "Our tin/lead conversion process is helping our customers to reliably prepare chip-scale passive components, including capacitors, inductors, resistors, ferrite chip beads, fuses, resistor arrays, capacitor arrays, bead arrays, and many molded body passive and active surface-mount component types for use in mission critical and life-sustaining applications."