CPD73-CMFBR-6F
140mA,60V Bare die,25.000 X 25.000 mils,Rectifier-Bridge
Case Type: WAFER
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IF = 20 mA
Test Conditions
f = 1 MHz
Test Conditions
IR = 100 µA
Test Conditions
IF = 10 mA
IR = 10 mA
IREC = 1 mA
Test Conditions
VR = 50 V
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CPD73-CMFBR-6F-WN | Wafer | Discontinued | 140mA,60V Bare die,25.000 X 25.000 mils,Rectifier-Bridge | EAR99 | 8541.10.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Alloy 42 leadframe | Analytical Test Report |
| Analytical Test Report:Bond Wire | Analytical Test Report |
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Epoxy Adhesive | Analytical Test Report |
| Analytical Test Report:Halogen Free | Analytical Test Report |
| Analytical Test Report:Pure Tin Solder, Sn | Analytical Test Report |
| CPD73.PDF | Device Datasheet |
| Material Composition:SOT-143 | Material Composition |
| Package Detail Document:SOT-143 | Package Detail Document |
| Product EOL Notice:CMKBR-6F / CMFBR-6F | Product EOL Notice |
| Step File 3D Object:SOT-143 (TO-253AA) | Step File 3D Object |
Product Support
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Design Support
Contact Design SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
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- Online technical data and parametric search
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- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development