CPL03-CMJD5750

Bare die,15.700 X 15.700 mils,CLD Series

Case Type: CHIP,WAFFLE

Dynamic Impedance (Z_T)

0.05 MΩ

Junction Temperature (T_j)

-65 — 150 °C

Knee Impedance (Z_K)

5 kΩ

Limiting Voltage (V_L)

4.5 V

Peak Operating Voltage (P_OV)

100 V

Power Dissipation (P_D)

445 mW

Power Dissipation (P_D)

780 mW

Regulator Current (I_P)

5 — 6.5 mA

(5.75 mA Typical)

Storage Temperature (T_stg)

-65 — 150 °C

Temperature Coefficient (T_C)

-0.53 — -0.25 %/°C

Thermal Resistance Junction-Ambient (Θ_JA)

280 °C/W

Thermal Resistance Junction-Ambient (Θ_JA)

160 °C/W

Part	Package	Status	Description	ECCN Code	HTS Code	Termination
CPL03-CMJD5750-CM	WafflePack@400	Active	Bare die,15.700 X 15.700 mils,CLD Series	EAR99	8541.10.0040	PBFREE
CPL03-CMJD5750-CT	WafflePack@400	Active	Bare die,15.700 X 15.700 mils,CLD Series	EAR99	8541.10.0040	PBFREE
CPL03-CMJD5750-CT20	WafflePack@20	Special Order Item	Bare die,15.700 X 15.700 mils,CLD Series	EAR99	8541.10.0040	PBFREE


Item	Type
No matching documents found.
CPL03-CMJD0130_SERIES_WPD.PDF	Device Datasheet
Material Composition:DFN123F	Material Composition
Package Detail Document:DFN123F	Package Detail Document
Product Brief:PB CMJD SER	Product Brief
Product Reliability Data:DFN123F Package Reliability	Product Reliability Data
Spice Model:Spice Model CMJD5750	Spice Model