CPL03-CMJD5750

Bare die,15.700 X 15.700 mils,CLD Series

Case Type: CHIP,WAFFLE

Dynamic Impedance (Z_T)

0.05 MΩ

Junction Temperature (T_j)

-65 — 150 °C

Knee Impedance (Z_K)

5 kΩ

Limiting Voltage (V_L)

4.5 V

Peak Operating Voltage (P_OV)

100 V

Power Dissipation (P_D)

445 mW

Power Dissipation (P_D)

780 mW

Regulator Current (I_P)

5 — 6.5 mA

(5.75 mA Typical)

Storage Temperature (T_stg)

-65 — 150 °C

Temperature Coefficient (T_C)

-0.53 — -0.25 %/°C

Thermal Resistance Junction-Ambient (Θ_JA)

280 °C/W

Thermal Resistance Junction-Ambient (Θ_JA)

160 °C/W

Part	Package	Status	Description	ECCN Code	HTS Code	Termination
CPL03-CMJD5750-CM	WafflePack@400	Active	Bare die,15.700 X 15.700 mils,CLD Series	EAR99	8541.10.0040	PBFREE
CPL03-CMJD5750-CT	WafflePack@400	Active	Bare die,15.700 X 15.700 mils,CLD Series	EAR99	8541.10.0040	PBFREE
CPL03-CMJD5750-CT20	WafflePack@20	Special Order Item	Bare die,15.700 X 15.700 mils,CLD Series	EAR99	8541.10.0040	PBFREE
CPL03-CMJD5750-WN	Wafer	Active	Bare die,15.700 X 15.700 mils,CLD Series	EAR99	8541.10.0040	PBFREE


Item	Type
No matching documents found.
CPL03-CMJD0130_SERIES_WPD.PDF	Device Datasheet
Material Composition:DFN123F	Material Composition
Package Detail Document:DFN123F	Package Detail Document
Product Brief:PB CMJD SER	Product Brief
Product Reliability Data:DFN123F Package Reliability	Product Reliability Data
Spice Model:Spice Model CMJD5750	Spice Model

AEM stands ready to assist with your latest design endeavors as your trusted partner.

AEM stands ready to assist with your latest design endeavors as your trusted partner.