CPL03-CMJDH180

Bare die,15.700 X 15.700 mils,CLD Series

Case Type: CHIP,WAFFLE

Dynamic Impedance (Z_T)

0.02 MΩ

Junction Temperature (T_j)

-65 — 150 °C

Knee Impedance (Z_K)

1.8 kΩ

Limiting Voltage (V_L)

4.6 V

Peak Operating Voltage (P_OV)

50 V

Power Dissipation (P_D)

329 mW

Power Dissipation (P_D)

580 mW

Regulator Current (I_P)

16 — 20 mA

(18 mA Typical)

Storage Temperature (T_stg)

-65 — 150 °C

Temperature Coefficient (T_C)

-0.45 — -0.25 %/°C

Thermal Resistance Junction-Ambient (Θ_JA)

380 °C/W

Thermal Resistance Junction-Ambient (Θ_JA)

215 °C/W

Part	Package	Status	Description	ECCN Code	HTS Code	Termination
CPL03-CMJDH180-CM	WafflePack@400	Active	Bare die,15.700 X 15.700 mils,CLD Series	EAR99	8541.10.0040	PBFREE
CPL03-CMJDH180-CT	WafflePack@400	Active	Bare die,15.700 X 15.700 mils,CLD Series	EAR99	8541.10.0040	PBFREE
CPL03-CMJDH180-CT20	WafflePack@20	Special Order Item	Bare die,15.700 X 15.700 mils,CLD Series	EAR99	8541.10.0040	PBFREE


Item	Type
No matching documents found.
CPL03-CMJDH080_SERIES_WPD.PDF	Device Datasheet
Material Composition:DFN123F	Material Composition
Package Detail Document:DFN123F	Package Detail Document
Product Brief:PB CMJD SER	Product Brief
Product Reliability Data:DFN123F Package Reliability	Product Reliability Data
Spice Model:Spice Model CMJDH180	Spice Model