CPD06-1N5554

3A,1000V Bare die,89.000 X 89.000 mils,Rectifier-General Purpose

Case Type: CHIP,WAFFLE

Average Forward Current (I_O)

3 A

Continuous Reverse Voltage (V_R)

1000 V

Forward Voltage (V_F)

1.1 V

Junction Temperature (T_j)

-65 — 200 °C

Peak Forward Surge Current (I_FSM)

100 A

Peak Repetitive Reverse Voltage (V_RRM)

1000 V

Reverse Breakdown Voltage (B_VR)

1100 V

Reverse Recovery Time (t_rr)

4 µs

Reverse Voltage Leakage Current (I_R)

1 µA

Reverse Voltage Leakage Current (I_R)

75 µA

RMS Reverse Voltage (V_R(RMS))

700 V

Storage Temperature (T_stg)

-65 — 200 °C

Thermal Resistance Junction-Lead (Θ_JL)

30 °C/W

Part	Package	Buy	Status	Description	ECCN Code	HTS Code	Termination
CPD06-1N5554-CT	WafflePack@100		Active	3A,1000V Bare die,89.000 X 89.000 mils,Rectifier-General Purpose	EAR99	8541.10.0040	PBFREE
CPD06-1N5554-WN	Wafer		Active	3A,1000V Bare die,89.000 X 89.000 mils,Rectifier-General Purpose	EAR99	8541.10.0040	PBFREE


Item	Type
No matching documents found.
Analytical Test Report:Active Device, Rectifier	Analytical Test Report
Analytical Test Report:Die	Analytical Test Report
Analytical Test Report:Die	Analytical Test Report
Analytical Test Report:TVS Die	Analytical Test Report
Analytical Test Report:Wafer Rectifier	Analytical Test Report
Analytical Test Report:Wafer Schottky	Analytical Test Report
Analytical Test Report:Wafer Switching Diode	Analytical Test Report
Analytical Test Report:Wafer Transistor	Analytical Test Report
Analytical Test Report:Wafer Zener	Analytical Test Report
Analytical Test Report:Wafer/Die	Analytical Test Report
Package Detail Document:WAFER	Package Detail Document
Process Change Notice:CPD06 Anode Pad Size Increase	Process Change Notice
Spice Model:Spice Model CPD06	Spice Model

AEM stands ready to assist with your latest design endeavors as your trusted partner.

AEM stands ready to assist with your latest design endeavors as your trusted partner.