CPD16-CMR1U-04M

1A,400V Bare die,50.000 X 50.000 mils,Rectifier-Ultra Fast <100ns

Case Type: CHIP,WAFFLE

Average Forward Current (I_O)

1 A

Continuous Reverse Voltage (V_R)

400 V

Forward Recovery Time (t_fr)

250 ns

(175 ns Typical)

Forward Voltage (V_F)

1.25 V

Junction Temperature (T_j)

-65 — 175 °C

Peak Forward Surge Current (I_FSM)

30 A

Peak Repetitive Reverse Voltage (V_RRM)

400 V

Reverse Recovery Time (t_rr)

50 ns

Reverse Voltage Leakage Current (I_R)

5 µA

RMS Reverse Voltage (V_R(RMS))

280 V

Storage Temperature (T_stg)

-65 — 175 °C

Thermal Resistance Junction-Lead (Θ_JL)

30 °C/W

Part	Package	Buy	Status	Description	ECCN Code	HTS Code	Termination
CPD16-CMR1U-04M-CT	WafflePack@400		Active	1A,400V Bare die,50.000 X 50.000 mils,Rectifier-Ultra Fast <100ns	EAR99	8541.10.0040	PBFREE
CPD16-CMR1U-04M-WN	Wafer		Active	1A,400V Bare die,50.000 X 50.000 mils,Rectifier-Ultra Fast <100ns	EAR99	8541.10.0040	PBFREE


Item	Type
No matching documents found.
Analytical Test Report:Active Device, Rectifier	Analytical Test Report
Analytical Test Report:Die	Analytical Test Report
Analytical Test Report:Die	Analytical Test Report
Analytical Test Report:TVS Die	Analytical Test Report
Analytical Test Report:Wafer Rectifier	Analytical Test Report
Analytical Test Report:Wafer Schottky	Analytical Test Report
Analytical Test Report:Wafer Switching Diode	Analytical Test Report
Analytical Test Report:Wafer Transistor	Analytical Test Report
Analytical Test Report:Wafer Zener	Analytical Test Report
Analytical Test Report:Wafer/Die	Analytical Test Report
CPD16-CMR1U-04M_WPD.PDF	Device Datasheet
Package Detail Document:WAFER	Package Detail Document
Spice Model:Spice Model CPD16	Spice Model

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AEM stands ready to assist with your latest design endeavors as your trusted partner.