CPD17-CMR3U-04

3A,400V Bare die,88.000 X 88.000 mils,Rectifier-Ultra Fast <100ns

Case Type: CHIP,WAFFLE

Average Forward Current (IO)
3 A
Continuous Reverse Voltage (VR)
400 V
Forward Voltage (VF)
1.25 V
Junction Temperature (Tj)
-65 — 175 °C
Peak Forward Surge Current (IFSM)
100 A
Peak Repetitive Reverse Voltage (VRRM)
400 V
Reverse Recovery Time (trr)
50 ns
Reverse Voltage Leakage Current (IR)
5 µA
Reverse Voltage Leakage Current (IR)
500 µA
RMS Reverse Voltage (VR(RMS))
280 V
Storage Temperature (Tstg)
-65 — 175 °C
Thermal Resistance Junction-Lead (ΘJL)
10 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CPD17-CMR3U-04-CT WafflePack@100 Active 3A,400V Bare die,88.000 X 88.000 mils,Rectifier-Ultra Fast <100ns EAR99 8541.10.0040 PBFREE
CPD17-CMR3U-04-WN Wafer Active 3A,400V Bare die,88.000 X 88.000 mils,Rectifier-Ultra Fast <100ns EAR99 8541.10.0040 PBFREE

Resources

Analytical Test Report:Active Device, Rectifier Analytical Test Report
Analytical Test Report:Die Analytical Test Report
Analytical Test Report:Die Analytical Test Report
Analytical Test Report:TVS Die Analytical Test Report
Analytical Test Report:Wafer Rectifier Analytical Test Report
Analytical Test Report:Wafer Schottky Analytical Test Report
Analytical Test Report:Wafer Switching Diode Analytical Test Report
Analytical Test Report:Wafer Transistor Analytical Test Report
Analytical Test Report:Wafer Zener Analytical Test Report
Analytical Test Report:Wafer/Die Analytical Test Report
CPD17-CMR3U-04_WPD.PDF Device Datasheet
Package Detail Document:WAFER Package Detail Document
Spice Model:Spice Model CPD17 Spice Model

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