CPD18-CUDD8-04

8A,400V Bare die,98.000 X 98.000 mils,Rectifier-Ultra Fast <100ns

Case Type: CHIP,WAFFLE

Average Forward Current (I_O)

8 A

Continuous Reverse Voltage (V_R)

400 V

Forward Voltage (V_F)

1.3 V

Forward Voltage (V_F)

1.1 V

Junction Capacitance (C_J)

60 pF

Junction Temperature (T_j)

-65 — 150 °C

Peak Forward Surge Current (I_FSM)

125 A

Peak Repetitive Reverse Voltage (V_RRM)

400 V

Reverse Recovery Time (t_rr)

25 ns

Reverse Voltage Leakage Current (I_R)

10 µA

Reverse Voltage Leakage Current (I_R)

500 µA

RMS Reverse Voltage (V_R(RMS))

280 V

Storage Temperature (T_stg)

-65 — 150 °C

Typical Thermal Resistance Junction-Ambient (Θ_JA)

50 °C/W

Typical Thermal Resistance Junction-Case (Θ_JC)

5 °C/W

Part	Package	Buy	Status	Description	ECCN Code	HTS Code	Termination
CPD18-CUDD8-04-CT	WafflePack@100		Active	8A,400V Bare die,98.000 X 98.000 mils,Rectifier-Ultra Fast <100ns	EAR99	8541.10.0040	PBFREE


Item	Type
No matching documents found.
Analytical Test Report:Active Device, Rectifier	Analytical Test Report
Analytical Test Report:Die	Analytical Test Report
Analytical Test Report:Die	Analytical Test Report
Analytical Test Report:Wafer Schottky	Analytical Test Report
Analytical Test Report:Wafer Schottky	Analytical Test Report
Analytical Test Report:Wafer Switching Diode	Analytical Test Report
Analytical Test Report:Wafer Transistor	Analytical Test Report
Analytical Test Report:Wafer Zener	Analytical Test Report
Analytical Test Report:Wafer/Die	Analytical Test Report
CPD18-CUDD8-04_WPD.PDF	Device Datasheet
Package Detail Document:WAFER	Package Detail Document
Spice Model:Spice Model CPD18	Spice Model