CPD18-CUDD8-04
8A,400V Bare die,98.000 X 98.000 mils,Rectifier-Ultra Fast <100ns
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IF = 8 A
Test Conditions
IF = 8 A
TC = 150 °C
Test Conditions
VR = 10 V
f = 1 MHz
Test Conditions
IF = 0.5 A
IR = 1 A
Irr = 0.25 A
Test Conditions
VR = 400 V
Test Conditions
VR = 400 V
TC = 150 °C
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CPD18-CUDD8-04-CT | WafflePack@100 | Active | 8A,400V Bare die,98.000 X 98.000 mils,Rectifier-Ultra Fast <100ns | EAR99 | 8541.10.0040 | PBFREE | |
| CPD18-CUDD8-04-WN | Wafer | Active | 8A,400V Bare die,98.000 X 98.000 mils,Rectifier-Ultra Fast <100ns | EAR99 | 8541.10.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CPD18-CUDD8-04_WPD.PDF | Device Datasheet |
| Material Composition:D2PAK | Material Composition |
| Package Detail Document:D2PAK | Package Detail Document |
| Process Change Notice:D2PAK CASE | Process Change Notice |
| Process Change Notice:fast, hyperfast, superfast, | Process Change Notice |
| Product Reliability Data:D2PAK Package Reliability | Product Reliability Data |
| Spice Model:Spice Model CUDD8-04 | Spice Model |
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Design Support
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