CPD19-CHD8-06
8A,600V Bare die,87.000 X 87.000 mils,Rectifier-Hyperfast <25ns
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IF = 8 A
(1.9 V Typical)
Test Conditions
VR = 4 V
f = 1 MHz
(26 pF Typical)
Test Conditions
IF = 8 A
VR = 400 V
di/dt = 200 A/µs
(22 ns Typical)
Test Conditions
VR = 600 V
Test Conditions
VR = 600 V
TA = 150 °C
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CPD19-CHD8-06-CT | WafflePack@100 | Active | 8A,600V Bare die,87.000 X 87.000 mils,Rectifier-Hyperfast <25ns | EAR99 | 8541.10.0040 | PBFREE | |
| CPD19-CHD8-06-WN | Wafer | Active | 8A,600V Bare die,87.000 X 87.000 mils,Rectifier-Hyperfast <25ns | EAR99 | 8541.10.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Ni added Al Bond Wire | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CPD19-CHD8-06_WPD.PDF | Device Datasheet |
| Material Composition:DPAK | Material Composition |
| Package Detail Document:DPAK | Package Detail Document |
| Process Change Notice:DPAK Case | Process Change Notice |
| Product Brief:PB HYPERFAST RECTIFIERS | Product Brief |
| Product Reliability Data:DPAK Package Reliability | Product Reliability Data |
| Spice Model:Spice Model CHD8-06 | Spice Model |
Product Support
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Design Support
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- Online technical data and parametric search
- SPICE models
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- Environmental regulation compliance
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- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development