CPD24-1N4934

1A,100V Bare die,50.500 X 50.500 mils,Rectifier-Fast Recovery <500ns

Case Type: CHIP,WAFFLE

Average Forward Current (I_O)

1 A

Forward Voltage (V_F)

1.2 V

Junction Capacitance (C_J)

15 pF

Junction Temperature (T_j)

-50 — 150 °C

Peak Forward Surge Current (I_FSM)

30 A

Peak Repetitive Reverse Voltage (V_RRM)

100 V

Reverse Recovery Time (t_rr)

200 ns

Reverse Voltage Leakage Current (I_R)

5 µA

Reverse Voltage Leakage Current (I_R)

100 µA

RMS Reverse Voltage (V_R(RMS))

70 V

Storage Temperature (T_stg)

-50 — 150 °C

Part	Package	Buy	Status	Description	ECCN Code	HTS Code	Termination
CPD24-1N4934-CT	WafflePack@400		Active	1A,100V Bare die,50.500 X 50.500 mils,Rectifier-Fast Recovery <500ns	EAR99	8541.10.0040	PBFREE
CPD24-1N4934-WN	Wafer		Active	1A,100V Bare die,50.500 X 50.500 mils,Rectifier-Fast Recovery <500ns	EAR99	8541.10.0040	PBFREE


Item	Type
No matching documents found.
Analytical Test Report:Active Device, Rectifier	Analytical Test Report
Analytical Test Report:Die	Analytical Test Report
Analytical Test Report:Die	Analytical Test Report
Analytical Test Report:TVS Die	Analytical Test Report
Analytical Test Report:Wafer Rectifier	Analytical Test Report
Analytical Test Report:Wafer Schottky	Analytical Test Report
Analytical Test Report:Wafer Switching Diode	Analytical Test Report
Analytical Test Report:Wafer Transistor	Analytical Test Report
Analytical Test Report:Wafer Zener	Analytical Test Report
Analytical Test Report:Wafer/Die	Analytical Test Report
CPD24-1N4934_WPD.PDF	Device Datasheet
Package Detail Document:WAFER	Package Detail Document
Spice Model:Spice Model CPD24	Spice Model

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AEM stands ready to assist with your latest design endeavors as your trusted partner.