CPD24-CMR1F-06M

1A,600V Bare die,50.500 X 50.500 mils,Rectifier-Fast Recovery <500ns

Case Type: CHIP,WAFFLE

Average Forward Current (I_O)

1 A

Continuous Reverse Voltage (V_R)

600 V

Forward Voltage (V_F)

1.3 V

Junction Capacitance (C_J)

35 pF

Junction Temperature (T_j)

-65 — 150 °C

Peak Forward Surge Current (I_FSM)

30 A

Peak Repetitive Reverse Voltage (V_RRM)

600 V

Reverse Recovery Time (t_rr)

250 ns

Reverse Voltage Leakage Current (I_R)

5 µA

Reverse Voltage Leakage Current (I_R)

200 µA

RMS Reverse Voltage (V_R(RMS))

420 V

Storage Temperature (T_stg)

-65 — 150 °C

Thermal Resistance Junction-Lead (Θ_JL)

30 °C/W

Part	Package	Buy	Status	Description	ECCN Code	HTS Code	Termination
CPD24-CMR1F-06M-CT	WafflePack@400		Active	1A,600V Bare die,50.500 X 50.500 mils,Rectifier-Fast Recovery <500ns	EAR99	8541.10.0040	PBFREE


Item	Type
No matching documents found.
Analytical Test Report:Die	Analytical Test Report
Analytical Test Report:Die Attach	Analytical Test Report
Analytical Test Report:Die Attach	Analytical Test Report
Analytical Test Report:Epoxy Molding Compound	Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound	Analytical Test Report
Analytical Test Report:Lead frame	Analytical Test Report
Analytical Test Report:Lead Frame	Analytical Test Report
Analytical Test Report:Leadframe	Analytical Test Report
Analytical Test Report:Molding Compound	Analytical Test Report
Analytical Test Report:Plating	Analytical Test Report
Analytical Test Report:Sn Plating	Analytical Test Report
Analytical Test Report:Solder	Analytical Test Report
Analytical Test Report:Tin Ingot	Analytical Test Report
CPD24-CMR1F-06M_WPD.PDF	Device Datasheet
Material Composition:SMA	Material Composition
Package Detail Document:SMA TR13	Package Detail Document
Process Change Notice:SMA CASE	Process Change Notice
Product Reliability Data:SMA Package Reliability	Product Reliability Data
Spice Model:Spice Model CMR1F-06M	Spice Model