CPD69-1N5614

1A,200V Bare die,42.500 X 42.500 mils,Rectifier-General Purpose

Case Type: CHIP,WAFFLE

Average Forward Current (I_O)

1 A

Continuous Reverse Voltage (V_R)

200 V

Forward Voltage (V_F)

1.2 V

Junction Capacitance (C_J)

35 pF

Junction Temperature (T_j)

-65 — 200 °C

Peak Forward Surge Current (I_FSM)

40 A

Peak Repetitive Reverse Voltage (V_RRM)

200 V

Reverse Breakdown Voltage (B_VR)

220 V

Reverse Recovery Time (t_rr)

2 µs

Reverse Voltage Leakage Current (I_R)

500 nA

Reverse Voltage Leakage Current (I_R)

25 µA

RMS Reverse Voltage (V_R(RMS))

140 V

Storage Temperature (T_stg)

-65 — 200 °C

Part	Package	Buy	Status	Description	ECCN Code	HTS Code	Termination
CPD69-1N5614-CM	WafflePack@400		Active	1A,200V Bare die,42.500 X 42.500 mils,Rectifier-General Purpose	EAR99	8541.10.0040	PBFREE
CPD69-1N5614-CT	WafflePack@400		Active	1A,200V Bare die,42.500 X 42.500 mils,Rectifier-General Purpose	EAR99	8541.10.0040	PBFREE


Item	Type
No matching documents found.
Analytical Test Report:Die Attach	Analytical Test Report
Analytical Test Report:Molybdenum encapsulation	Analytical Test Report
CPD69-1N5614_WPD.PDF	Device Datasheet
Material Composition:GPR-1A	Material Composition
Package Detail Document:GPR-1A	Package Detail Document
Product EOL Notice:GPR Series	Product EOL Notice