CPD69-CMR1-02M

1A,200V Bare die,42.500 X 42.500 mils,Rectifier-General Purpose

Case Type: CHIP,WAFFLE

Average Forward Current (IO)
1 A
Continuous Reverse Voltage (VR)
200 V
Forward Voltage (VF)
1.1 V
Junction Temperature (Tj)
-65 — 175 °C
Peak Forward Surge Current (IFSM)
30 A
Peak Repetitive Reverse Voltage (VRRM)
200 V
Reverse Voltage Leakage Current (IR)
10 µA
Reverse Voltage Leakage Current (IR)
50 µA
RMS Reverse Voltage (VR(RMS))
140 V
Storage Temperature (Tstg)
-65 — 175 °C
Thermal Resistance Junction-Lead (ΘJL)
20 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CPD69-CMR1-02M-CT WafflePack@400 Active 1A,200V Bare die,42.500 X 42.500 mils,Rectifier-General Purpose EAR99 8541.10.0040 PBFREE
CPD69-CMR1-02M-WN Wafer Active 1A,200V Bare die,42.500 X 42.500 mils,Rectifier-General Purpose EAR99 8541.10.0040 PBFREE
CPD69-CMR1-02M-WR Wafer Active 1A,200V Bare die,42.500 X 42.500 mils,Rectifier-General Purpose EAR99 8541.10.0040 PBFREE

Resources

Analytical Test Report:Active Device, Rectifier Analytical Test Report
Analytical Test Report:Die Analytical Test Report
Analytical Test Report:Die Analytical Test Report
Analytical Test Report:TVS Die Analytical Test Report
Analytical Test Report:Wafer Rectifier Analytical Test Report
Analytical Test Report:Wafer Schottky Analytical Test Report
Analytical Test Report:Wafer Switching Diode Analytical Test Report
Analytical Test Report:Wafer Transistor Analytical Test Report
Analytical Test Report:Wafer Zener Analytical Test Report
Analytical Test Report:Wafer/Die Analytical Test Report
CPD69-CMR1-02M_WPD.PDF Device Datasheet
Package Detail Document:WAFER Package Detail Document

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