CPD69-CMR1-02M

1A,200V Bare die,42.500 X 42.500 mils,Rectifier-General Purpose

Case Type: CHIP,WAFFLE

Average Forward Current (I_O)

1 A

Continuous Reverse Voltage (V_R)

200 V

Forward Voltage (V_F)

1.1 V

Junction Capacitance (C_J)

8 pF

Junction Temperature (T_j)

-65 — 150 °C

Peak Forward Surge Current (I_FSM)

30 A

Peak Repetitive Reverse Voltage (V_RRM)

200 V

Reverse Voltage Leakage Current (I_R)

5 µA

Reverse Voltage Leakage Current (I_R)

50 µA

RMS Reverse Voltage (V_R(RMS))

140 V

Storage Temperature (T_stg)

-65 — 150 °C

Thermal Resistance Junction-Lead (Θ_JL)

30 °C/W

Part	Package	Buy	Status	Description	ECCN Code	HTS Code	Termination
CPD69-CMR1-02M-CT	WafflePack@400		Active	1A,200V Bare die,42.500 X 42.500 mils,Rectifier-General Purpose	EAR99	8541.10.0040	PBFREE


Item	Type
No matching documents found.
Analytical Test Report:Active Device, Rectifier	Analytical Test Report
Analytical Test Report:Die	Analytical Test Report
Analytical Test Report:Die	Analytical Test Report
Analytical Test Report:Wafer Schottky	Analytical Test Report
Analytical Test Report:Wafer Schottky	Analytical Test Report
Analytical Test Report:Wafer Switching Diode	Analytical Test Report
Analytical Test Report:Wafer Transistor	Analytical Test Report
Analytical Test Report:Wafer Zener	Analytical Test Report
Analytical Test Report:Wafer/Die	Analytical Test Report
CPD69-CMR1-02M_WPD.PDF	Device Datasheet
Package Detail Document:WAFER	Package Detail Document
Process Change Notice:CPD69 Wafer Thickness Increase	Process Change Notice
Spice Model:Spice Model CPD69	Spice Model