CPD102X-CMPD6263

Technical Specifications

Continuous Forward Current (I_F)

15 mA

Forward Voltage (V_F)

410 mV

(395 mV Typical)

Junction Capacitance (C_J)

2 pF

Junction Temperature (T_j)

-65 — 150 °C

Peak Forward Surge Current (I_FSM)

50 mA

Peak Repetitive Reverse Voltage (V_RRM)

70 V

Power Dissipation (P_D)

350 mW

Reverse Breakdown Voltage (B_VR)

70 V

Reverse Voltage Leakage Current (I_R)

200 nA

(10 nA Typical)

Storage Temperature (T_stg)

-65 — 150 °C

Thermal Resistance Junction-Ambient (Θ_JA)

357 °C/W

Part	Package	Status	Description	ECCN Code	HTS Code	Termination
CPD102X-CMPD6263-CT	WafflePack@1,024	Not Recommended for New Design	70V Bare die,9.060 X 9.060 mils,Diode-Schottky (<1A)	EAR99	8541.10.0040	PBFREE
CPD102X-CMPD6263-WN	Wafer	Not Recommended for New Design	70V Bare die,9.060 X 9.060 mils,Diode-Schottky (<1A)	EAR99	8541.10.0040	PBFREE
CPD102X-CMPD6263-WR	Wafer	Not Recommended for New Design	70V Bare die,9.060 X 9.060 mils,Diode-Schottky (<1A)	EAR99	8541.10.0040	PBFREE


Item	Type
No matching documents found.
Analytical Test Report:Active Device, Rectifier	Analytical Test Report
Analytical Test Report:Die	Analytical Test Report
Analytical Test Report:Die	Analytical Test Report
Analytical Test Report:TVS Die	Analytical Test Report
Analytical Test Report:Wafer Rectifier	Analytical Test Report
Analytical Test Report:Wafer Schottky	Analytical Test Report
Analytical Test Report:Wafer Switching Diode	Analytical Test Report
Analytical Test Report:Wafer Transistor	Analytical Test Report
Analytical Test Report:Wafer Zener	Analytical Test Report
Analytical Test Report:Wafer/Die	Analytical Test Report
CPD102X-CMPD6263_WPD.PDF	Device Datasheet
Package Detail Document:WAFER	Package Detail Document
Product EOL Notice:BLANKET PDN-BARE DIE PRODUCTS	Product EOL Notice
Spice Model:Spice Model CPD92X	Spice Model

AEM stands ready to assist with your latest design endeavors as your trusted partner.

AEM stands ready to assist with your latest design endeavors as your trusted partner.