Home / Products / Die Solutions / Diodes and Rectifiers / Schottky Diodes and Rectifiers / CPD112R-SH05-20L

CPD112R-SH05-20L

Bare die,14.960 X 14.960 mils,Low VF Schottky Diode

Case Type: CHIP,WAFFLE

Back to Top Specifications Ordering Resources Support

Technical Specifications

Similar Products with Selected Specifications
Average Forward Current (IO)
500 mA
Continuous Reverse Voltage (VR)
20 V
Forward Voltage (VF)
180 mV

(100 mV Typical)

Forward Voltage (VF)
240 mV

(160 mV Typical)

Forward Voltage (VF)
290 mV

(220 mV Typical)

Forward Voltage (VF)
380 mV

(310 mV Typical)

Forward Voltage (VF)
500 mV

(450 mV Typical)

Junction Capacitance (CJ)
30 pF

(21 pF Typical)

Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current (IFSM)
3 A
Peak Repetitive Reverse Voltage (VRRM)
20 V
Reverse Breakdown Voltage (BVR)
20 V
Reverse Voltage Leakage Current (IR)
30 µA

(8 µA Typical)

Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
1000 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CPD112R-SH05-20L-CM WafflePack@400 Active Bare die,14.960 X 14.960 mils,Low VF Schottky Diode EAR99 8541.10.0040 PBFREE
CPD112R-SH05-20L-CT WafflePack@400 Active Bare die,14.960 X 14.960 mils,Low VF Schottky Diode EAR99 8541.10.0040 PBFREE
CPD112R-SH05-20L-WN Wafer Active Bare die,14.960 X 14.960 mils,Low VF Schottky Diode EAR99 8541.10.0040 PBFREE

Resources

Item Type
Analytical Test Report:Active Device, Rectifier Analytical Test Report
Analytical Test Report:Die Analytical Test Report
Analytical Test Report:Die Analytical Test Report
Analytical Test Report:TVS Die Analytical Test Report
Analytical Test Report:Wafer Rectifier Analytical Test Report
Analytical Test Report:Wafer Schottky Analytical Test Report
Analytical Test Report:Wafer Switching Diode Analytical Test Report
Analytical Test Report:Wafer Transistor Analytical Test Report
Analytical Test Report:Wafer Zener Analytical Test Report
Analytical Test Report:Wafer/Die Analytical Test Report
Package Detail Document:WAFER Package Detail Document

Product Support

Contact Product Support

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

Design Support

Contact Design Support

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development