CPD48V-CBAT54

Bare die,13.777 X 13.777 mils,Diode-Schottky (<1A),0.2A, 30V Schottky Diode

Case Type: CHIP,WAFFLE

Continuous Forward Current (I_F)

200 mA

Continuous Reverse Voltage (V_R)

30 V

Diode Capacitance (C_d)

10 pF

Forward Voltage (V_F)

240 mV

Forward Voltage (V_F)

320 mV

Forward Voltage (V_F)

400 mV

Forward Voltage (V_F)

800 mV

Forward Voltage (V_F)

500 mV

Junction Temperature (T_j)

-65 — 150 °C

Peak Forward Surge Current (I_FSM)

600 mA

Peak Repetitive Forward Current (I_FRM)

300 mA

Power Dissipation (P_D)

350 mW

Reverse Recovery Time (t_rr)

5 ns

Reverse Voltage Leakage Current (I_R)

2 µA

Storage Temperature (T_stg)

-65 — 150 °C

Thermal Resistance Junction-Ambient (Θ_JA)

357 °C/W

Part	Package	Buy	Status	Description	ECCN Code	HTS Code	Termination
CPD48V-CBAT54-CM	WafflePack@400		Active	Bare die,13.777 X 13.777 mils,Diode-Schottky (<1A),0.2A, 30V Schottky Diode	EAR99	8541.10.0040	PBFREE
CPD48V-CBAT54-CT	WafflePack@400		Active	Bare die,13.777 X 13.777 mils,Diode-Schottky (<1A),0.2A, 30V Schottky Diode	EAR99	8541.10.0040	PBFREE


Item	Type
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CPD48V-CBAT54_WPD.PDF	Device Datasheet
Material Composition:SOT-23	Material Composition
Package Detail Document:SOT-23	Package Detail Document
Process Change Notice:All Switching, Schottky and	Process Change Notice
Process Change Notice:Copper Wire Bonding	Process Change Notice
Product Reliability Data:SOT-23 Package Reliability	Product Reliability Data
Spice Model:Spice Model CBAT54	Spice Model
Step File 3D Object:SOT-23	Step File 3D Object