CPD48V-CMPSH-3

30V Bare die,13.777 X 13.777 mils,Rectifier-Schottky (>=1A)

Case Type: CHIP,WAFFLE

Continuous Forward Current (IF)
100 mA
Forward Voltage (VF)
330 mV

(290 mV Typical)

Forward Voltage (VF)
450 mV

(370 mV Typical)

Forward Voltage (VF)
1 V

(0.51 V Typical)

Junction Capacitance (CJ)
20 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current (IFSM)
750 mA
Peak Repetitive Forward Current (IFRM)
350 mA
Peak Repetitive Reverse Voltage (VRRM)
30 V
Power Dissipation (PD)
350 mW
Reverse Breakdown Voltage (BVR)
30 V
Reverse Recovery Time (trr)
5 ns
Reverse Voltage Leakage Current (IR)
500 nA

(90 nA Typical)

Reverse Voltage Leakage Current (IR)
100 µA

(25 µA Typical)

Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
357 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CPD48V-CMPSH-3-CT WafflePack@400 Active 30V Bare die,13.777 X 13.777 mils,Rectifier-Schottky (>=1A) EAR99 8541.10.0040 PBFREE

Resources

Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Henkel 84-1LMISR4 Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CPD48V-CMPSH-3_WPD.PDF Device Datasheet
Material Composition:SOT-23 Material Composition
Package Detail Document:SOT-23 Package Detail Document
Process Change Notice:All Switching, Schottky and Process Change Notice
Process Change Notice:Copper Wire Bonding Process Change Notice
Process Change Notice:Tin Wafer Backside Metal Process Change Notice
Product Reliability Data:SOT-23 Package Reliability Product Reliability Data
Spice Model:Spice Model CMPSH-3 Spice Model
Step File 3D Object:SOT-23 Step File 3D Object