CPD76X-1N5818

1A,30V Bare die,32.300 X 32.300 mils,Rectifier-Schottky (>=1A)

Case Type: CHIP,WAFFLE

Average Forward Current (I_O)

1 A

Continuous Reverse Voltage (V_R)

30 V

Forward Voltage (V_F)

330 mV

Forward Voltage (V_F)

550 mV

Forward Voltage (V_F)

875 mV

Junction Temperature (T_j)

-65 — 150 °C

Peak Forward Surge Current (I_FSM)

25 A

Peak Repetitive Reverse Voltage (V_RRM)

30 V

Reverse Voltage Leakage Current (I_R)

1 mA

Reverse Voltage Leakage Current (I_R)

10 mA

RMS Reverse Voltage (V_R(RMS))

21 V

Storage Temperature (T_stg)

-65 — 150 °C

Part	Package	Buy	Status	Description	ECCN Code	HTS Code	Termination
CPD76X-1N5818-CT	WafflePack@400		Please Call	1A,30V Bare die,32.300 X 32.300 mils,Rectifier-Schottky (>=1A)	EAR99	8541.10.0040	PBFREE


Item	Type
No matching documents found.
Analytical Test Report:Epoxy Molding Compound	Analytical Test Report
Analytical Test Report:Glass Encapsulation	Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound	Analytical Test Report
Analytical Test Report:Sn Plating	Analytical Test Report
Analytical Test Report:Sn Plating	Analytical Test Report
CPD76X-1N5818_WPD.PDF	Device Datasheet
Material Composition:DO-41	Material Composition
Package Detail Document:DO-41	Package Detail Document
Process Change Notice:AXIAL LEAD PRODUCTS	Process Change Notice
Product Reliability Data:DO-41 Package Reliability	Product Reliability Data
Spice Model:Spice Model 1N5818	Spice Model