CPD81X-CZSH5-40

5A,40V Bare die,72.440 X 72.440 mils,Rectifier-Schottky (>=1A)

Case Type: CHIP,WAFFLE

Average Forward Current (I_O)

5 A

Continuous Reverse Voltage (V_R)

40 V

Forward Voltage (V_F)

550 mV

Junction Temperature (T_j)

-65 — 150 °C

Peak Forward Surge Current (I_FSM)

125 A

Peak Repetitive Reverse Voltage (V_RRM)

40 V

Reverse Voltage Leakage Current (I_R)

3 mA

Reverse Voltage Leakage Current (I_R)

20 mA

RMS Reverse Voltage (V_R(RMS))

28 V

Storage Temperature (T_stg)

-65 — 150 °C

Part	Package	Buy	Status	Description	ECCN Code	HTS Code	Termination
CPD81X-CZSH5-40-CT	WafflePack@324		Active	5A,40V Bare die,72.440 X 72.440 mils,Rectifier-Schottky (>=1A)	EAR99	8541.10.0040	PBFREE


Item	Type
No matching documents found.
Analytical Test Report:Copper Bond Wire	Analytical Test Report
Analytical Test Report:Gold Bond Wire	Analytical Test Report
Analytical Test Report:Lead frame	Analytical Test Report
Analytical Test Report:Leadframe	Analytical Test Report
Analytical Test Report:Sn Plating	Analytical Test Report
CPD81X-CZSH5-40_WPD.PDF	Device Datasheet
Material Composition:SOT-223	Material Composition
Package Detail Document:SOT-223	Package Detail Document
Process Change Notice:Copper Wire Bonding - SOT-223	Process Change Notice
Product EOL Notice:All devices in SOT-223 Case	Product EOL Notice
Product Reliability Data:SOT-223 Package Reliability	Product Reliability Data
Spice Model:Spice Model CZSH5-40	Spice Model
Step File 3D Object:SOT-223	Step File 3D Object