CPD66X-1N3595
Bare die,17.500 X 17.500 mils,Diode-Switching,Low Leakage Switching Diode
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IF = 1 mA
Test Conditions
IF = 5 mA
Test Conditions
IF = 10 mA
Test Conditions
IF = 50 mA
Test Conditions
IF = 100 mA
Test Conditions
IF = 200 mA
Test Conditions
f = 1 MHz
Test Conditions
IR = 100 µA
Test Conditions
IF = 10 mA
VR = 3.5 V
RL = 1 kΩ
Test Conditions
VR = 125 V
Test Conditions
VR = 125 V
TA = 125 °C
Test Conditions
VR = 125 V
TA = 150 °C
Test Conditions
VR = 30 V
TA = 125 °C
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CPD66X-1N3595-CM | WafflePack@400 | Active | Bare die,17.500 X 17.500 mils,Diode-Switching,Low Leakage Switching Diode | EAR99 | 8541.10.0040 | PBFREE | |
| CPD66X-1N3595-CT | WafflePack@400 | Active | Bare die,17.500 X 17.500 mils,Diode-Switching,Low Leakage Switching Diode | EAR99 | 8541.10.0040 | PBFREE | |
| CPD66X-1N3595-CT20 | WafflePack@20 | Special Order Item | Bare die,17.500 X 17.500 mils,Diode-Switching,Low Leakage Switching Diode | EAR99 | 8541.10.0040 | PBFREE | |
| CPD66X-1N3595-WN | Wafer | Active | Bare die,17.500 X 17.500 mils,Diode-Switching,Low Leakage Switching Diode | EAR99 | 8541.10.0040 | PBFREE | |
| CPD66X-1N3595-WR | Wafer | Active | Bare die,17.500 X 17.500 mils,Diode-Switching,Low Leakage Switching Diode | EAR99 | 8541.10.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CPD66X-1N3595_WPD.PDF | Device Datasheet |
| Material Composition:SOD-123 | Material Composition |
| Package Detail Document:SOD-123 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding | Process Change Notice |
| Process Change Notice:CPD64 REPLACED WITH CPD66X | Process Change Notice |
| Process Change Notice:CPD66X DOPANT CHANGE | Process Change Notice |
| Product Reliability Data:SOD-123 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model CMHD3595 | Spice Model |
Product Support
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- Supply management (Customer portals)
- Inventory bonding
- Consolidated shipping options
- Custom bar coding for shipments
- Custom product packing
Design Support
Contact Design SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Free quick ship samples (2nd day air)
- Online technical data and parametric search
- SPICE models
- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development