CPD66X-CMPD3003
200mA,200V Bare die,17.500 X 17.500 mils,Diode-Low Leakage
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IF = 1 mA
Test Conditions
IF = 10 mA
Test Conditions
IF = 50 mA
Test Conditions
IF = 100 mA
Test Conditions
IF = 200 mA
Test Conditions
IF = 300 mA
Test Conditions
f = 1 MHz
Test Conditions
IR = 5 µA
Test Conditions
VR = 125 V
Test Conditions
VR = 125 V
TA = 150 °C
Test Conditions
VR = 180 V
Test Conditions
VR = 180 V
TA = 150 °C
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CPD66X-CMPD3003-CT | WafflePack@400 | Active | 200mA,200V Bare die,17.500 X 17.500 mils,Diode-Low Leakage | EAR99 | 8541.10.0040 | PBFREE |
Resources
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|---|---|
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| CPD66X-CMPD3003_WPD.PDF | Device Datasheet |
| Material Composition:SOD-523 | Material Composition |
| Package Detail Document:SOD-523 | Package Detail Document |
| Product Reliability Data:SOD-523 Package Reliability | Product Reliability Data |