CPD83V-1N4448
150mA,100V Bare die,11.027 X 11.027 mils,Diode-Switching
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IF = 100 mA
Test Conditions
IF = 5 mA
Test Conditions
f = 1 MHz
Test Conditions
IR = 5 µA
Test Conditions
IR = 100 µA
Test Conditions
IF = 10 mA
IREC = 1 mA
VR = 6 V
RL = 100 Ω
Test Conditions
VR = 20 V
Test Conditions
VR = 20 V
TA = 150 °C
Test Conditions
VR = 20 V
TA = 100 °C
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CPD83V-1N4448-CT | WafflePack@400 | Active | 150mA,100V Bare die,11.027 X 11.027 mils,Diode-Switching | EAR99 | 8541.10.0040 | PBFREE | |
| CPD83V-1N4448-WN | Wafer | Active | 150mA,100V Bare die,11.027 X 11.027 mils,Diode-Switching | EAR99 | 8541.10.0040 | PBFREE |
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