CPD83V-1N4448
150mA,100V Bare die,11.027 X 11.027 mils,Diode-Switching
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IF = 100 mA
Test Conditions
IF = 5 mA
Test Conditions
f = 1 MHz
Test Conditions
IR = 5 µA
Test Conditions
IR = 100 µA
Test Conditions
IF = 10 mA
IREC = 1 mA
VR = 6 V
RL = 100 Ω
Test Conditions
VR = 20 V
Test Conditions
VR = 20 V
TA = 150 °C
Test Conditions
VR = 20 V
TA = 100 °C
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CPD83V-1N4448-CT | WafflePack@400 | Active | 150mA,100V Bare die,11.027 X 11.027 mils,Diode-Switching | EAR99 | 8541.10.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CPD83V-1N4448_WPD.PDF | Device Datasheet |
| Material Composition:SOT-523 | Material Composition |
| Package Detail Document:SOT-523 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding - SOT-523 | Process Change Notice |
| Product Reliability Data:SOT-523 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model CMUD4448 | Spice Model |
| Step File 3D Object:SOT-523 (SC-89) | Step File 3D Object |