Home / Products / Die Solutions / Diodes and Rectifiers / Switching Diodes / CPD91V-CD6001

CPD91V-CD6001

Bare die,11.030 X 11.030 mils,Low Leakage Switching Diode

Case Type: CHIP,WAFFLE

Back to Top Specifications Ordering Resources Support

Technical Specifications

Similar Products with Selected Specifications
Average Forward Current (IO)
250 mA
Continuous Reverse Voltage (VR)
75 V
Forward Voltage (VF)
850 mV
Forward Voltage (VF)
950 mV
Forward Voltage (VF)
1.1 V
Junction Capacitance (CJ)
2 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current (IFSM)
4 A
Peak Forward Surge Current (IFSM)
1 A
Peak Repetitive Reverse Voltage (VRRM)
100 V
Power Dissipation (PD)
250 mW
Reverse Breakdown Voltage (BVR)
100 V
Reverse Recovery Time (trr)
3 µs
Reverse Voltage Leakage Current (IR)
500 pA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Case (ΘJC)
500 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CPD91V-CD6001-CT200 WafflePack@200 Special Order Item Bare die,11.030 X 11.030 mils,Low Leakage Switching Diode EAR99 8541.10.0040 PBFREE

Resources

Item Type
Analytical Test Report:Active Device, Rectifier Analytical Test Report
Analytical Test Report:Die Analytical Test Report
Analytical Test Report:Die Analytical Test Report
Analytical Test Report:Wafer Schottky Analytical Test Report
Analytical Test Report:Wafer Switching Diode Analytical Test Report
Analytical Test Report:Wafer Transistor Analytical Test Report
CPD91V-CMPD6001_WPD.PDF Device Datasheet
Package Detail Document:WAFER Package Detail Document

Product Support

Contact Product Support

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

Design Support

Contact Design Support

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development