CPZ18-1N4623

4.3V,250mW Bare die,13.779 X 13.779 mils,Diode-Zener

Case Type: CHIP,WAFFLE

Forward Voltage (V_F)

1 V

Junction Temperature (T_j)

-65 — 200 °C

Maximum Zener Current (I_ZM)

65 mA

Noise Density (N_D)

Power Dissipation (P_D)

250 mW

Reverse Voltage Leakage Current (I_R)

4 µA

Storage Temperature (T_stg)

-65 — 200 °C

Zener Impedance (Z_ZT)

1600 Ω

Zener Voltage (V_Z)

4.085 — 4.515 V

(4.3 V Typical)

Part	Package	Buy	Status	Description	ECCN Code	HTS Code	Termination
CPZ18-1N4623-CT	WafflePack@400		Discontinued, Stock Only	4.3V,250mW Bare die,13.779 X 13.779 mils,Diode-Zener	EAR99	8541.10.0040	PBFREE


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