CPZ18-1N5230B

4.7V,500mW Bare die,13.779 X 13.779 mils,Diode-Zener

Case Type: CHIP,WAFFLE

Forward Voltage (V_F)

1.2 V

Junction Temperature (T_j)

-65 — 200 °C

Maximum Temperature Coefficient (ΘV_Z)

-0.03 — 0.03 %/°C

Power Dissipation (P_D)

500 mW

Reverse Voltage Leakage Current (I_R)

5 µA

Storage Temperature (T_stg)

-65 — 200 °C

Zener Impedance (Z_ZT)

19 Ω

Zener Knee Impedance (Z_ZK)

1900 Ω

Zener Voltage (V_Z)

4.465 — 4.935 V

(4.7 V Typical)

Part	Package	Buy	Status	Description	ECCN Code	HTS Code	Termination
CPZ18-1N5230B-CT	WafflePack@400		Discontinued, Stock Only	4.7V,500mW Bare die,13.779 X 13.779 mils,Diode-Zener	EAR99	8541.10.0040	PBFREE


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