CPZ18-CMPZ4626

5.6V,350mW Bare die,13.779 X 13.779 mils,Diode-Zener

Case Type: CHIP,WAFFLE

Forward Voltage (V_F)

1 V

Junction Temperature (T_j)

-65 — 150 °C

Maximum Zener Current (I_ZM)

50 mA

Noise Density (N_D)

Power Dissipation (P_D)

350 mW

Reverse Voltage Leakage Current (I_R)

10 µA

Storage Temperature (T_stg)

-65 — 150 °C

Zener Impedance (Z_ZT)

1400 Ω

Zener Voltage (V_Z)

5.32 — 5.88 V

(5.6 V Typical)

Part	Package	Buy	Status	Description	ECCN Code	HTS Code	Termination
CPZ18-CMPZ4626-CT	WafflePack@400		Discontinued	5.6V,350mW Bare die,13.779 X 13.779 mils,Diode-Zener	EAR99	8541.10.0040	PBFREE


Item	Type
No matching documents found.
Analytical Test Report:Active Device, Rectifier	Analytical Test Report
Analytical Test Report:Die	Analytical Test Report
Analytical Test Report:Die	Analytical Test Report
Analytical Test Report:Wafer Schottky	Analytical Test Report
Analytical Test Report:Wafer Switching Diode	Analytical Test Report
Analytical Test Report:Wafer Transistor	Analytical Test Report
CPZ18.PDF	Device Datasheet
Package Detail Document:WAFER	Package Detail Document
Process Change Notice:CPZ18 REPLACED WITH CPZ28X	Process Change Notice
Product EOL Notice:BLANKET PDN-BARE DIE PRODUCTS	Product EOL Notice