CPZ18-CMPZ5227B

3.6V,350mW Bare die,13.779 X 13.779 mils,Diode-Zener

Case Type: WAFER

Forward Voltage (VF)
900 mV
Junction Temperature (Tj)
-65 — 150 °C
Maximum Temperature Coefficient (ΘVZ)
-0.065 %/°C
Power Dissipation (PD)
350 mW
Reverse Voltage Leakage Current (IR)
15 µA
Storage Temperature (Tstg)
-65 — 150 °C
Zener Impedance (ZZT)
24 Ω
Zener Knee Impedance (ZZK)
1700 Ω
Zener Voltage (VZ)
3.42 — 3.78 V

(3.6 V Typical)

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CPZ18-CMPZ5227B-WN Wafer Discontinued, Stock Only 3.6V,350mW Bare die,13.779 X 13.779 mils,Diode-Zener EAR99 8541.10.0040 PBFREE

Resources

Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Halogen Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Lead frame Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CPZ18-CMPZ5221B_SERIES_WPD.PDF Device Datasheet
Material Composition:SOD-323 Material Composition
Package Detail Document:SOD-323 Package Detail Document
Process Change Notice:CPZ18 REPLACED WITH CPZ28X Process Change Notice
Process Change Notice:CPZ28x ----> CPZ58X/CPZ59X Process Change Notice
Product EOL Notice:All P/Ns in the SOD-323 case Product EOL Notice
Product Reliability Data:SOD-323 Package Reliability Product Reliability Data

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development