CPZ18-CMPZ5228B

3.9V,350mW Bare die,13.779 X 13.779 mils,Diode-Zener

Case Type: CHIP,WAFFLE

Forward Voltage (V_F)

900 mV

Junction Temperature (T_j)

-65 — 150 °C

Maximum Temperature Coefficient (ΘV_Z)

-0.06 %/°C

Power Dissipation (P_D)

350 mW

Reverse Voltage Leakage Current (I_R)

10 µA

Storage Temperature (T_stg)

-65 — 150 °C

Zener Impedance (Z_ZT)

23 Ω

Zener Knee Impedance (Z_ZK)

1900 Ω

Zener Voltage (V_Z)

3.705 — 4.095 V

(3.9 V Typical)

Part	Package	Buy	Status	Description	ECCN Code	HTS Code	Termination
CPZ18-CMPZ5228B-CT	WafflePack@400		Discontinued, Stock Only	3.9V,350mW Bare die,13.779 X 13.779 mils,Diode-Zener	EAR99	8541.10.0040	PBFREE


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