CPZ19-1N5255B
28V,500mW Bare die,17.716 X 17.716 mils,Diode-Zener
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IF = 200 mA
Test Conditions
VR = 21 V
Test Conditions
IZT = 4.5 mA
Test Conditions
IZK = 250 µA
Test Conditions
IZT = 4.5 mA
(28 V Typical)
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CPZ19-1N5255B-CM200 | WafflePack@200 | Discontinued | 28V,500mW Bare die,17.716 X 17.716 mils,Diode-Zener | EAR99 | 8541.10.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
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| CPZ19.PDF | Device Datasheet |
| Material Composition:SOT-23 | Material Composition |
| Package Detail Document:SOT-23 | Package Detail Document |
| Process Change Notice:All Switching, Schottky and | Process Change Notice |
| Process Change Notice:Copper Wire Bonding | Process Change Notice |
| Process Change Notice:CPZ28x ----> CPZ58X/CPZ59X | Process Change Notice |
| Product Reliability Data:SOT-23 Package Reliability | Product Reliability Data |
| Step File 3D Object:SOT-23 | Step File 3D Object |