CPZ19-BZX55C22

Bare die,17.716 X 17.716 mils,0.5W Zener Diode

Case Type: CHIP,WAFFLE

Forward Voltage (V_F)

900 mV

Junction Temperature (T_j)

-65 — 150 °C

Maximum Temperature Coefficient (ΘV_Z)

0.077 %/°C

Power Dissipation (P_D)

350 mW

Reverse Voltage Leakage Current (I_R)

1 µA

Storage Temperature (T_stg)

-65 — 150 °C

Zener Impedance (Z_ZT)

30 Ω

Zener Knee Impedance (Z_ZK)

600 Ω

Zener Voltage (V_Z)

11.4 — 12.6 V

(12 V Typical)

Part	Package	Buy	Status	Description	ECCN Code	HTS Code	Termination
CPZ19-BZX55C22-CT	WafflePack@400		Discontinued	Bare die,17.716 X 17.716 mils,0.5W Zener Diode	EAR99	8541.10.0040	PBFREE


Item	Type
No matching documents found.
Analytical Test Report:Active Device, Rectifier	Analytical Test Report
Analytical Test Report:Die	Analytical Test Report
Analytical Test Report:Die	Analytical Test Report
Analytical Test Report:Wafer Schottky	Analytical Test Report
Analytical Test Report:Wafer Switching Diode	Analytical Test Report
Analytical Test Report:Wafer Transistor	Analytical Test Report
CPZ19-BZX55C6V8_SERIES_WPD.PDF	Device Datasheet
Package Detail Document:WAFER	Package Detail Document
Process Change Notice:CPZ19 REPLACED WITH CPZ28	Process Change Notice
Product EOL Notice:CPZ18 / CPZ19 devices	Product EOL Notice

AEM stands ready to assist with your latest design endeavors as your trusted partner.

AEM stands ready to assist with your latest design endeavors as your trusted partner.