CPZ19-CMPZ5260B

43V,350mW Bare die,17.716 X 17.716 mils,Diode-Zener

Case Type: CHIP,WAFFLE

Forward Voltage (V_F)

900 mV

Junction Temperature (T_j)

-65 — 150 °C

Maximum Temperature Coefficient (ΘV_Z)

0.095 %/°C

Power Dissipation (P_D)

350 mW

Reverse Voltage Leakage Current (I_R)

0.1 µA

Storage Temperature (T_stg)

-65 — 150 °C

Zener Impedance (Z_ZT)

93 Ω

Zener Knee Impedance (Z_ZK)

900 Ω

Zener Voltage (V_Z)

40.85 — 45.15 V

(43 V Typical)

Part	Package	Buy	Status	Description	ECCN Code	HTS Code	Termination
CPZ19-CMPZ5260B-CT	WafflePack@400		Limited Availability	43V,350mW Bare die,17.716 X 17.716 mils,Diode-Zener	EAR99	8541.10.0040	PBFREE


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