CPZ25-1N4734A

Bare die,33.500 X 33.500 mils,Diode-Zener,8.5W Zener Diode

Case Type: CHIP,WAFFLE

Forward Voltage (V_F)

1.2 V

Junction Temperature (T_j)

-65 — 200 °C

Maximum Zener Current (I_ZM)

810 mA

Power Dissipation (P_D)

1 W

Reverse Voltage Leakage Current (I_R)

10 µA

Storage Temperature (T_stg)

-65 — 200 °C

Zener Impedance (Z_ZT)

5 Ω

Zener Knee Impedance (Z_ZK)

600 Ω

Zener Voltage (V_Z)

5.32 — 5.88 V

(5.6 V Typical)

Part	Package	Buy	Status	Description	ECCN Code	HTS Code	Termination
CPZ25-1N4734A-CT	WafflePack@400		Active	Bare die,33.500 X 33.500 mils,Diode-Zener,8.5W Zener Diode	EAR99	8541.10.0040	PBFREE


Item	Type
No matching documents found.
Analytical Test Report:Epoxy Molding Compound	Analytical Test Report
Analytical Test Report:Glass Encapsulation	Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound	Analytical Test Report
Analytical Test Report:Sn Plating	Analytical Test Report
Analytical Test Report:Sn Plating	Analytical Test Report
Material Composition:DO-41	Material Composition
Package Detail Document:DO-41	Package Detail Document
Process Change Notice:AXIAL LEAD PRODUCTS	Process Change Notice
Product Reliability Data:DO-41 Package Reliability	Product Reliability Data