CPZ25-1N4744A
15V,1W Bare die,33.500 X 33.500 mils,Diode-Zener
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IF = 200 mA
Test Conditions
VR = 11.4 V
Test Conditions
IZT = 17 mA
Test Conditions
IZK = 0.25 mA
Test Conditions
IZT = 17 mA
(15 V Typical)
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CPZ25-1N4744A-CM | WafflePack@400 | Active | 15V,1W Bare die,33.500 X 33.500 mils,Diode-Zener | EAR99 | 8541.10.0040 | PBFREE | |
| CPZ25-1N4744A-CT | WafflePack@400 | Active | 15V,1W Bare die,33.500 X 33.500 mils,Diode-Zener | EAR99 | 8541.10.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Glass Encapsulation | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CPZ25-1N4728A_SERIES_WPD.PDF | Device Datasheet |
| Material Composition:DO-41 | Material Composition |
| Package Detail Document:DO-41 | Package Detail Document |
| Process Change Notice:AXIAL LEAD PRODUCTS | Process Change Notice |
| Product Reliability Data:DO-41 Package Reliability | Product Reliability Data |