CPZ25-1N5913B

3.3V,1.5W Bare die,33.500 X 33.500 mils,Diode-Zener

Case Type: CHIP,WAFFLE

Forward Voltage (VF)
1.5 V
Junction Temperature (Tj)
-65 — 200 °C
Maximum Zener Current (IZM)
454 mA
Power Dissipation (PD)
1.5 W
Reverse Voltage Leakage Current (IR)
100 µA
Storage Temperature (Tstg)
-65 — 200 °C
Zener Impedance (ZZT)
10 Ω
Zener Knee Impedance (ZZK)
500 Ω
Zener Voltage (VZ)
3.135 — 3.465 V

(3.3 V Typical)

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CPZ25-1N5913B-CT WafflePack@400 Active 3.3V,1.5W Bare die,33.500 X 33.500 mils,Diode-Zener EAR99 8541.10.0040 PBFREE

Resources

Analytical Test Report:Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Glass Encapsulation Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CPZ25-1N5913B_SERIES_WPD.PDF Device Datasheet
Material Composition:DO-41 Material Composition
Package Detail Document:DO-41 Package Detail Document
Product EOL Notice:1N5913B THRU 1N5916B Product EOL Notice
Product Reliability Data:DO-41 Package Reliability Product Reliability Data