CPZ25-1N5918B

5.1V,1.5W Bare die,33.500 X 33.500 mils,Diode-Zener

Case Type: CHIP,WAFFLE

Forward Voltage (V_F)

1.5 V

Junction Temperature (T_j)

-65 — 200 °C

Maximum Zener Current (I_ZM)

294 mA

Power Dissipation (P_D)

1.5 W

Reverse Voltage Leakage Current (I_R)

5 µA

Storage Temperature (T_stg)

-65 — 200 °C

Zener Impedance (Z_ZT)

4 Ω

Zener Knee Impedance (Z_ZK)

350 Ω

Zener Voltage (V_Z)

4.845 — 5.355 V

(5.1 V Typical)

Part	Package	Buy	Status	Description	ECCN Code	HTS Code	Termination
CPZ25-1N5918B-CT	WafflePack@400		Active	5.1V,1.5W Bare die,33.500 X 33.500 mils,Diode-Zener	EAR99	8541.10.0040	PBFREE


Item	Type
No matching documents found.
Analytical Test Report:Active Device, Rectifier	Analytical Test Report
Analytical Test Report:Die	Analytical Test Report
Analytical Test Report:Die	Analytical Test Report
Analytical Test Report:Wafer Schottky	Analytical Test Report
Analytical Test Report:Wafer Schottky	Analytical Test Report
Analytical Test Report:Wafer Switching Diode	Analytical Test Report
Analytical Test Report:Wafer Transistor	Analytical Test Report
Analytical Test Report:Wafer Zener	Analytical Test Report
Analytical Test Report:Wafer/Die	Analytical Test Report
CPZ25-1N5913B_SERIES_WPD.PDF	Device Datasheet
Package Detail Document:WAFER	Package Detail Document