CPZ25-1N5918B

5.1V,1.5W Bare die,33.500 X 33.500 mils,Diode-Zener

Case Type: CHIP,WAFFLE

Forward Voltage (V_F)

1.5 V

Junction Temperature (T_j)

-65 — 200 °C

Maximum Zener Current (I_ZM)

294 mA

Power Dissipation (P_D)

1.5 W

Reverse Voltage Leakage Current (I_R)

5 µA

Storage Temperature (T_stg)

-65 — 200 °C

Zener Impedance (Z_ZT)

4 Ω

Zener Knee Impedance (Z_ZK)

350 Ω

Zener Voltage (V_Z)

4.845 — 5.355 V

(5.1 V Typical)

Part	Package	Buy	Status	Description	ECCN Code	HTS Code	Termination
CPZ25-1N5918B-CT	WafflePack@400		Active	5.1V,1.5W Bare die,33.500 X 33.500 mils,Diode-Zener	EAR99	8541.10.0040	PBFREE


Item	Type
No matching documents found.
Analytical Test Report:Die Attach	Analytical Test Report
Analytical Test Report:Epoxy Molding Compound	Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound	Analytical Test Report
Analytical Test Report:Hi-Lead Solder Paste	Analytical Test Report
Analytical Test Report:Lead frame	Analytical Test Report
Analytical Test Report:Lead Frame	Analytical Test Report
Analytical Test Report:Molding Compound	Analytical Test Report
Analytical Test Report:Sn Plating	Analytical Test Report
Analytical Test Report:Solder	Analytical Test Report
Analytical Test Report:Tin Ingot	Analytical Test Report
CPZ25-1N5913B_SERIES_WPD.PDF	Device Datasheet
Material Composition:SMA	Material Composition
Package Detail Document:SMA TR13	Package Detail Document
Process Change Notice:SMA, SMB, SMC, DO-41, DO-201	Process Change Notice
Product EOL Notice:SMA/SMB/SMC ZENERS	Product EOL Notice
Product Reliability Data:SMA Package Reliability	Product Reliability Data
Spice Model:Spice Model CMZ5918B	Spice Model