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CPZ25-1N5918B

5.1V,1.5W Bare die,33.500 X 33.500 mils,Diode-Zener

Case Type: CHIP,WAFFLE

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Technical Specifications

Similar Products with Selected Specifications
Forward Voltage (VF)
1.5 V
Junction Temperature (Tj)
-65 — 200 °C
Maximum Zener Current (IZM)
294 mA
Power Dissipation (PD)
1.5 W
Reverse Voltage Leakage Current (IR)
5 µA
Storage Temperature (Tstg)
-65 — 200 °C
Zener Impedance (ZZT)
4 Ω
Zener Knee Impedance (ZZK)
350 Ω
Zener Voltage (VZ)
4.845 — 5.355 V

(5.1 V Typical)

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CPZ25-1N5918B-CT WafflePack@400 Active 5.1V,1.5W Bare die,33.500 X 33.500 mils,Diode-Zener EAR99 8541.10.0040 PBFREE
CPZ25-1N5918B-WN Wafer Active 5.1V,1.5W Bare die,33.500 X 33.500 mils,Diode-Zener EAR99 8541.10.0040 PBFREE

Resources

Item Type
Analytical Test Report:Die Attach Analytical Test Report
Analytical Test Report:Die Attach Analytical Test Report
Analytical Test Report:Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Hi-Lead Solder Paste Analytical Test Report
Analytical Test Report:Lead frame Analytical Test Report
Analytical Test Report:Lead Frame Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Molding Compound Analytical Test Report
Analytical Test Report:Plating Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
Analytical Test Report:Solder Analytical Test Report
Analytical Test Report:Tin Ingot Analytical Test Report
CPZ25-1N5913B_SERIES_WPD.PDF Device Datasheet
Material Composition:SMA Material Composition
Package Detail Document:SMA TR13 Package Detail Document
Process Change Notice:SMA, SMB, SMC, DO-41, DO-201 Process Change Notice
Product EOL Notice:SMA/SMB/SMC ZENERS Product EOL Notice
Product Reliability Data:SMA Package Reliability Product Reliability Data
Spice Model:Spice Model CMZ5918B Spice Model

Product Support

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Design Support

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  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
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  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development