CPZ25-1N5938B

36V,1.5W Bare die,33.500 X 33.500 mils,Diode-Zener

Case Type: CHIP,WAFFLE

Forward Voltage (VF)
1.5 V
Junction Temperature (Tj)
-65 — 200 °C
Maximum Zener Current (IZM)
41 mA
Power Dissipation (PD)
1.5 W
Reverse Voltage Leakage Current (IR)
1 µA
Storage Temperature (Tstg)
-65 — 200 °C
Zener Impedance (ZZT)
38 Ω
Zener Knee Impedance (ZZK)
850 Ω
Zener Voltage (VZ)
34.2 — 37.8 V

(36 V Typical)

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CPZ25-1N5938B-CT WafflePack@400 Active 36V,1.5W Bare die,33.500 X 33.500 mils,Diode-Zener EAR99 8541.10.0040 PBFREE

Resources

Analytical Test Report:Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Glass Encapsulation Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
Material Composition:DO-41 Material Composition
Package Detail Document:DO-41 Package Detail Document
Product EOL Notice:1N5917B series Product EOL Notice
Product Reliability Data:DO-41 Package Reliability Product Reliability Data