CPZ25-CMZ5940B

43V,1.5W Bare die,33.500 X 33.500 mils,Diode-Zener

Case Type: CHIP,WAFFLE

Forward Voltage (V_F)

1.5 V

Junction Temperature (T_j)

-65 — 150 °C

Maximum Zener Current (I_ZM)

35 mA

Peak Forward Surge Current (I_FSM)

10 A

Peak Pulse Power (P_PK)

200 W

Peak Pulse Power (P_PK)

1000 W

Power Dissipation (P_D)

1.5 W

Power Dissipation (P_D)

500 mW

Reverse Voltage Leakage Current (I_R)

1 µA

Storage Temperature (T_stg)

-65 — 150 °C

Thermal Resistance Junction-Ambient (Θ_JA)

250 °C/W

Thermal Resistance Junction-Lead (Θ_JL)

50 °C/W

Zener Impedance (Z_ZT)

53 Ω

Zener Knee Impedance (Z_ZK)

950 Ω

Zener Voltage (V_Z)

40.85 — 45.15 V

(43 V Typical)

Part	Package	Buy	Status	Description	ECCN Code	HTS Code	Termination
CPZ25-CMZ5940B-CT	WafflePack@400		Active	43V,1.5W Bare die,33.500 X 33.500 mils,Diode-Zener	EAR99	8541.10.0040	PBFREE


Item	Type
No matching documents found.
Analytical Test Report:Die	Analytical Test Report
Analytical Test Report:Die Attach	Analytical Test Report
Analytical Test Report:Die Attach	Analytical Test Report
Analytical Test Report:Epoxy Molding Compound	Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound	Analytical Test Report
Analytical Test Report:Lead frame	Analytical Test Report
Analytical Test Report:Lead Frame	Analytical Test Report
Analytical Test Report:Leadframe	Analytical Test Report
Analytical Test Report:Molding Compound	Analytical Test Report
Analytical Test Report:Plating	Analytical Test Report
Analytical Test Report:Sn Plating	Analytical Test Report
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Analytical Test Report:Tin Ingot	Analytical Test Report
CPZ25-CMZ5913B_SERIES_WPD.PDF	Device Datasheet
Material Composition:SMA	Material Composition
Package Detail Document:SMA TR13	Package Detail Document
Process Change Notice:SMA CASE	Process Change Notice
Product Reliability Data:SMA Package Reliability	Product Reliability Data
Spice Model:Spice Model CMZ5940B	Spice Model