CPZ28-CMPZ5258B
36V,350mW Bare die,12.990 X 12.990 mils,Diode-Zener
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IF = 10 mA
Test Conditions
VR = 27 V
Test Conditions
IZT = 3.4 mA
Test Conditions
IZK = 250 µA
Test Conditions
IZT = 3.4 mA
(36 V Typical)
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CPZ28-CMPZ5258B-CTO | WafflePack@400 | Discontinued, Stock Only | 36V,350mW Bare die,12.990 X 12.990 mils,Diode-Zener | EAR99 | 8541.10.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Active Device, Rectifier | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Wafer Schottky | Analytical Test Report |
| Analytical Test Report:Wafer Switching Diode | Analytical Test Report |
| Analytical Test Report:Wafer Transistor | Analytical Test Report |
| CPZ28.PDF | Device Datasheet |
| Package Detail Document:WAFER | Package Detail Document |
Product Support
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- Supply management (Customer portals)
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- Consolidated shipping options
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- Custom product packing
Design Support
Contact Design SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Free quick ship samples (2nd day air)
- Online technical data and parametric search
- SPICE models
- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development