CPZ28X-1N4625

5.1V,250mW Bare die,12.990 X 12.990 mils,Diode-Zener

Case Type: CHIP,WAFFLE

Forward Voltage (VF)
1 V
Junction Temperature (Tj)
-65 — 200 °C
Maximum Zener Current (IZM)
55 mA
Noise Density (ND)
2
Power Dissipation (PD)
250 mW
Reverse Voltage Leakage Current (IR)
10 µA
Storage Temperature (Tstg)
-65 — 200 °C
Zener Impedance (ZZT)
1500 Ω
Zener Voltage (VZ)
4.845 — 5.355 V

(5.1 V Typical)

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CPZ28X-1N4625-CT WafflePack@400 Limited Availability 5.1V,250mW Bare die,12.990 X 12.990 mils,Diode-Zener EAR99 8541.10.0040 PBFREE
CPZ28X-1N4625-CT20 WafflePack@20 Limited Availability 5.1V,250mW Bare die,12.990 X 12.990 mils,Diode-Zener EAR99 8541.10.0040 PBFREE
CPZ28X-1N4625-WN Wafer Limited Availability 5.1V,250mW Bare die,12.990 X 12.990 mils,Diode-Zener EAR99 8541.10.0040 PBFREE

Resources

Analytical Test Report:Glass Encapsulation Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CPZ28X-1N4614-4627_WPD.PDF Device Datasheet
Material Composition:DO-35 Material Composition
Package Detail Document:DO-35 Package Detail Document
Process Change Notice:DO-35 Alternate Marking Process Change Notice
Product Reliability Data:DO-35 Package Reliability Product Reliability Data
Spice Model:Spice Model 1N4625 Spice Model

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development