CPZ28X-1N4627
6.2V,250mW Bare die,12.990 X 12.990 mils,Diode-Zener
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IF = 200 mA
Test Conditions
IZT = 250 µA
Test Conditions
VR = 5 V
Test Conditions
IZT = 250 µA
Test Conditions
IZT = 250 µA
(6.2 V Typical)
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CPZ28X-1N4627-CT | WafflePack@400 | Limited Availability | 6.2V,250mW Bare die,12.990 X 12.990 mils,Diode-Zener | EAR99 | 8541.10.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CPZ28X-1N4614-4627_WPD.PDF | Device Datasheet |
| Material Composition:SOT-23 | Material Composition |
| Package Detail Document:SOT-23 | Package Detail Document |
| Process Change Notice:All Switching, Schottky and | Process Change Notice |
| Process Change Notice:Copper Wire Bonding | Process Change Notice |
| Process Change Notice:CPZ18 REPLACED WITH CPZ28X | Process Change Notice |
| Process Change Notice:CPZ28x ----> CPZ58X/CPZ59X | Process Change Notice |
| Product Reliability Data:SOT-23 Package Reliability | Product Reliability Data |
| Step File 3D Object:SOT-23 | Step File 3D Object |