CPZ28X-1N4684
3.3V,500mW Bare die,12.990 X 12.990 mils,Diode-Zener
Case Type: CHIP,WAFFLE
Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IF = 100 mA
Test Conditions
IZ1 = 10 µA
IZ2 = 100 µA
Test Conditions
VR = 1.5 V
Test Conditions
IZT = 50 µA
(3.3 V Typical)
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CPZ28X-1N4684-CM | WafflePack@400 | Limited Availability | 3.3V,500mW Bare die,12.990 X 12.990 mils,Diode-Zener | EAR99 | 8541.10.0040 | PBFREE | |
| CPZ28X-1N4684-CT | WafflePack@400 | Limited Availability | 3.3V,500mW Bare die,12.990 X 12.990 mils,Diode-Zener | EAR99 | 8541.10.0040 | PBFREE | |
| CPZ28X-1N4684-WN | Wafer | Limited Availability | 3.3V,500mW Bare die,12.990 X 12.990 mils,Diode-Zener | EAR99 | 8541.10.0040 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CPZ28X-1N4678-4717_WPD.PDF | Device Datasheet |
| Material Composition:SOD-123 | Material Composition |
| Package Detail Document:SOD-123 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding | Process Change Notice |
| Process Change Notice:CPZ18 REPLACED WITH CPZ28X | Process Change Notice |
| Product Reliability Data:SOD-123 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model CMHZ4684 | Spice Model |
Product Support
Contact Product SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Supply management (Customer portals)
- Inventory bonding
- Consolidated shipping options
- Custom bar coding for shipments
- Custom product packing
Design Support
Contact Design SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Free quick ship samples (2nd day air)
- Online technical data and parametric search
- SPICE models
- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development