CPZ28X-1N5231B

5.1V,500mW Bare die,12.990 X 12.990 mils,Diode-Zener

Case Type: CHIP,WAFFLE

Forward Voltage (V_F)

1.2 V

Junction Temperature (T_j)

-65 — 200 °C

Maximum Temperature Coefficient (ΘV_Z)

-0.03 — 0.03 %/°C

Power Dissipation (P_D)

500 mW

Reverse Voltage Leakage Current (I_R)

5 µA

Storage Temperature (T_stg)

-65 — 200 °C

Zener Impedance (Z_ZT)

17 Ω

Zener Knee Impedance (Z_ZK)

1600 Ω

Zener Voltage (V_Z)

4.845 — 5.355 V

(5.1 V Typical)

Part	Package	Buy	Status	Description	ECCN Code	HTS Code	Termination
CPZ28X-1N5231B-CT	WafflePack@400		Active	5.1V,500mW Bare die,12.990 X 12.990 mils,Diode-Zener	EAR99	8541.10.0040	PBFREE


Item	Type
No matching documents found.
Analytical Test Report:Green Epoxy Molding Compound	Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound	Analytical Test Report
Analytical Test Report:Henkel 84-1LMISR4	Analytical Test Report
Analytical Test Report:Leadframe	Analytical Test Report
Analytical Test Report:Sn Plating	Analytical Test Report
CPZ28X-1N5221B_SERIES_WPD.PDF	Device Datasheet
Material Composition:SOT-363	Material Composition
Package Detail Document:SOT-363	Package Detail Document
Process Change Notice:CPZ18 REPLACED WITH CPZ28X	Process Change Notice
Product EOL Notice:CMKZ5221B	Product EOL Notice
Product Reliability Data:SOT-363 Package Reliability	Product Reliability Data
Step File 3D Object:SOT-363 (SC-88)	Step File 3D Object