CPZ28X-5236B

Bare die,12.990 X 12.990 mils,0.5W Zener Diode

Case Type: CHIP,WAFFLE

Forward Voltage (V_F)

1.5 V

Junction Temperature (T_j)

-65 — 150 °C

Maximum Zener Current (I_ZM)

85 mA

Noise Density (N_D)

Power Dissipation (P_D)

500 mW

Reverse Voltage Leakage Current (I_R)

0.8 µA

Storage Temperature (T_stg)

-65 — 150 °C

Thermal Resistance Junction-Ambient (Θ_JA)

312.5 °C/W

Thermal Resistance Junction-Lead (Θ_JL)

150 °C/W

Zener Impedance (Z_ZT)

1600 Ω

Zener Voltage (V_Z)

2.85 — 3.15 V

(3 V Typical)

Part	Package	Buy	Status	Description	ECCN Code	HTS Code	Termination
CPZ28X-5236B-CT200	WafflePack@200		Limited Availability	Bare die,12.990 X 12.990 mils,0.5W Zener Diode	EAR99	8541.10.0040	PBFREE


Item	Type
No matching documents found.
Analytical Test Report:Copper Bond Wire	Analytical Test Report
Analytical Test Report:Gold Bond Wire	Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound	Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound	Analytical Test Report
Analytical Test Report:Henkel 84-1LMISR4	Analytical Test Report
Analytical Test Report:Leadframe	Analytical Test Report
Analytical Test Report:Sn Plating	Analytical Test Report
CPZ28X_WPD.PDF	Device Datasheet
Material Composition:SOT-23	Material Composition
Package Detail Document:SOT-23	Package Detail Document
Process Change Notice:All Switching, Schottky and	Process Change Notice
Process Change Notice:Copper Wire Bonding	Process Change Notice
Process Change Notice:CPZ28x ----> CPZ58X/CPZ59X	Process Change Notice
Product Reliability Data:SOT-23 Package Reliability	Product Reliability Data
Spice Model:Spice Model CMPZ5236B	Spice Model
Step File 3D Object:SOT-23	Step File 3D Object