CPZ28X-84B9V1

Bare die,12.990 X 12.990 mils,0.5W Zener Diode

Case Type: CHIP,WAFFLE

Forward Voltage (VF)
1.5 V
Junction Temperature (Tj)
-65 — 150 °C
Maximum Zener Current (IZM)
85 mA
Noise Density (ND)
1
Power Dissipation (PD)
500 mW
Reverse Voltage Leakage Current (IR)
0.8 µA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
312.5 °C/W
Thermal Resistance Junction-Lead (ΘJL)
150 °C/W
Zener Impedance (ZZT)
1600 Ω
Zener Voltage (VZ)
2.85 — 3.15 V

(3 V Typical)

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CPZ28X-84B9V1-CT20 WafflePack@20 Limited Availability Bare die,12.990 X 12.990 mils,0.5W Zener Diode EAR99 8541.10.0040 PBFREE

Resources

Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CPZ28X.PDF Device Datasheet
Material Composition:SOT-23 Material Composition
Package Detail Document:SOT-23 Package Detail Document
Process Change Notice:All Switching, Schottky and Process Change Notice
Process Change Notice:Copper Wire Bonding Process Change Notice
Process Change Notice:CPZ28x ----> CPZ58X/CPZ59X Process Change Notice
Product Reliability Data:SOT-23 Package Reliability Product Reliability Data
Step File 3D Object:SOT-23 Step File 3D Object